Electrolube:

thermal-management-solutions-brochure-electrolubeThermal Management Solutions

During use, some electronic components can generate significant amounts of heat. Failure to effectively dissipate this heat away from the component and the device can lead to reliability concerns and reduced operational lifetimes.

Some of the most popular products in this category are featured below, the full range can be viewed in the brochure:

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HTCP: Non-Silicone Heat Transfer Compound Plus

htcpHTCP provides the ultimate in thermal conductivity together with the advantage of using non-silicone base oil. The exceptional properties obtained from HTCP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

Key properties:

  • Excellent non-creep characteristics
  • Very high thermal conductivity; 2.50 W/m.K
  • Wide operating temperature range: -50°C to +130°C
  • Low evaporation weight loss
  • White colour enabled treated parts to be easily identified
  • Low in toxicity

HTCX: Non-Silicone Heat Transfer Compound Xtra

htcxElectrolube HTCX is an enhanced version of HTC featuring improved thermal conductivity, lower oil bleed, and lower evaporation weight loss. HTCX is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any surface where thermal conductivity or heat dissipation is important.

It should be applied to the base and mounting studs of diodes, transistors, thyristors, heat sinks, silicone rectifiers and semi-conductors, thermostats, power resistors and radiators.

Key Properties:

  • Very low oil bleed and evaporation weight loss
  • Reduced viscosity for ease of application
  • Excellent non-creep characteristics
  • Very wide operating temperature range
  • Excellent thermal conductivity: 1.35 W/m.K
  • Low toxicity

    HTSP: Silicone Heat Transfer Compound Plus

    htspHTSP provides the ultimate in thermal conductivity together with the very wide temperature range obtained by using silicone base oils. The exceptional properties obtained from HTSP are due to the novel use of various metal oxide (ceramic) powders. These materials are electrically insulative to ensure that leakage currents can not be formed if the paste should come into contact with other parts of the assembly.

    Key Properties:

    • Superior thermal conductivity even at high temperatures 3.0 W/m.K
    • Excellent non-creep characteristics
    • Wide operating temperature range -50°C to +200°C
    • Low evaporation weight loss

      TCOR: Thermally Conductive Oxime RTV

      tcorElectrolube TCOR is a single component, 100% solids, low odour RTV which cures upon exposure to atmospheric moisture. The product offers a high degree of thermal conductivity and is suitable for use over a very wide temperature range, making it ideal for a wide variety of uses, particularly in automotive applications. Combining the properties of silicone rubber pads with those of a conventional heat transfer paste, TCOR has been designed to fill the gap between the device and heat sink, thus reducing the thermal resistance.

      It can be applied around components and power resistors to dissipate excess heat to heat sinks, avoiding any potential overheating and subsequent failures. It can be used as a low bond strength adhesive, sealant or gasketing compound.

      Key Properties:

      • Single part, low odour RTV
      • Very high thermal conductivity: 1.80 W/m.
      • Exceptionally wide operating temperature range: -50°C to +230°C
      • Moisture cure – releasing oxime upon cure
      • Easy to apply – use with TCR Gun Applicator
      • Good bond strength and remains flexible at high temperatures

        Ready to place an order?

        Whether ready to order or in need of a quote,
        don't hesitate to contact us.